Three‐dimensional Circuitisation of Plastic Mouldings

Abstract

This paper briefly discusses various solutions to 3‐D PCBs by giving an overview of available technologies. Specific attention is then directed to the author's company's technique. Coverage of aspects such as: Potential Market Size and Relationship to Existing Technologies, Functional Specification, Test Results, and Low Tool Costs is given.

Citation

Stevens, B.J. (1987), "Three‐dimensional Circuitisation of Plastic Mouldings", Circuit World, Vol. 13 No. 4, pp. 24-25. https://doi.org/10.1108/eb043898