Multilayer Rigid‐flex Printed Wiring Design Considerations

Abstract

Rigid‐flex printed wiring constructed in different multilayer configurations and with varying features is discussed. Materials used in rigid‐flex construction have widely varying properties which cause processing difficulties and thermal stress related problems which can be minimised by proper construction features. Examples of failure mechanisms due to improper construction or material usage are given. Design considerations which will avoid construction related defects are summarised.

Citation

Nicewarner, E. (1987), "Multilayer Rigid‐flex Printed Wiring Design Considerations", Circuit World, Vol. 13 No. 4, pp. 19-23. https://doi.org/10.1108/eb043896