Theoretical Considerations on the Thermal Expansion of Copper‐Invar‐Copper Metalcore Boards for Surface Mounting Technology

Abstract

A model for a symmetric three‐layer configuration is developed. This model refers to Cu/Invar/Cu (CIC) laminates. Calculated values for the coefficient of thermal expansion (CTE) are compared with literature values. The model is then extended to symmetric CIC‐Metalcore boards and its prediction is compared with experimental results. Shearing of FR‐4 is discussed.

Citation

Ritz, K. (1987), "Theoretical Considerations on the Thermal Expansion of Copper‐Invar‐Copper Metalcore Boards for Surface Mounting Technology", Circuit World, Vol. 13 No. 4, pp. 7-9. https://doi.org/10.1108/eb043888