Accelerated Ageing and Solderability Testing of Printed Wiring Boards

Abstract

There is at present much industry activity related to solderability testing. Test methods, test parameters, and accelerated ageing conditions are among the items being studied, but the bulk of the activity relates to component terminations, and not to printed wiring boards (PWBs). At Rockwell International's Collins Defense Communications, test programmes related to PWB ageing and solderability have been ongoing for several years. Data from natural ageing and from a variety of accelerated test methods have been compared. Results from several solderability test methods have also been compared. Recommendations are made for an accelerated ageing method and for solderability testing of PWBs.

Citation

Wooldridge, J.R. and Mather, J.C. (1987), "Accelerated Ageing and Solderability Testing of Printed Wiring Boards", Circuit World, Vol. 13 No. 4, pp. 4-6. https://doi.org/10.1108/eb043886