Blowholing in PTH Solder Fillets: Part 5 The Rôle of the Electroless Copper

Abstract

Data from laboratory and production scale tests are given that show that the efficiency of catalyst adsorption controls the coverage by the electroless copper deposit in plated‐through‐holes in FR‐4 laminate, and that this, in turn, governs the outgassing performance of the finished board. The nature of electroless copper nucleation and growth is discussed and the reasons for the formation of voids in the deposit are identified.

Citation

Lea, C. and Howie, F.H. (1986), "Blowholing in PTH Solder Fillets: Part 5 The Rôle of the Electroless Copper", Circuit World, Vol. 13 No. 1, pp. 35-42. https://doi.org/10.1108/eb043854