Chemical Copper Plating in the Additive Process
H‐J Ehrich
(Schering AG, Berlin, West Germany)
59
Abstract
The copper plating of through holes and PCB surfaces in the additive process places high demands on the chemical copper bath and the resultant deposit. This paper illustrates the extent to which specific characteristics of the deposition and inhibition mechanism can be used to advantage.
Citation
Ehrich, H. (1984), "Chemical Copper Plating in the Additive Process", Circuit World, Vol. 11 No. 1, pp. 35-37. https://doi.org/10.1108/eb043750
Publisher
:MCB UP Ltd
Copyright © 1984, MCB UP Limited