Creep and Fatigue Testing of Micro Solder Joints

Abstract

Against the background of the fact that solder joints crack owing to thermal cycling, the method of predicting the lifetime of a solder joint is critically discussed. The conclusion is that the working conditions of the solder joints have to be carefully analysed and to be brought into agreement with the material properties. On the basis of experimental values, it is shown how this can be done. Creep, relaxation and fatigue of solder joints are discussed.

Citation

Becker, G. (1984), "Creep and Fatigue Testing of Micro Solder Joints", Circuit World, Vol. 11 No. 1, pp. 4-7. https://doi.org/10.1108/eb043745