Tape Automated Bonding and its Impact on the PWB

Abstract

This paper briefly reviews the impact that tape automated bonding systems are having in the semiconductor industry and describes a recent development of a bumped testable TAB system suitable for direct assembly to PWBs. The impact that such a system will have on PWB technology is discussed.

Citation

Small, D.J. (1984), "Tape Automated Bonding and its Impact on the PWB", Circuit World, Vol. 10 No. 3, pp. 26-29. https://doi.org/10.1108/eb043725