Low Temperature Soldering

Abstract

Soldering of electronic components on printed boards generally takes place at temperatures of between 240 and 250°C. During soldering, the components and printed boards are exposed to thermal shock that affects their long‐term reliability. A reduction in the soldering temperature to about 180°C using low melting point solders is expected to decrease component failures. The authors describe tests on a number of possible solders and the development of a suitable low temperature flux.

Citation

Strauss, R. and Smernos, S. (1984), "Low Temperature Soldering", Circuit World, Vol. 10 No. 3, pp. 23-25. https://doi.org/10.1108/eb043724