Hydrogen Peroxide/Sulphuric Acid Etching Systems

Abstract

The paper deals with the use of a Hydrogen Peroxide/Sulphuric Acid etchant in the Through‐Hole Plating system. The relative merits of this solution compared to currently used etchants such as Ammonium Persulphate are discussed on the basis of cost, convenience of operation and ecological effect.

Citation

Simpkins, D.C. (1979), "Hydrogen Peroxide/Sulphuric Acid Etching Systems", Circuit World, Vol. 6 No. 1, pp. 54-57. https://doi.org/10.1108/eb043607