The Resistance of Space‐Quality Solder Joints to Thermal Fatigue: Part 2

Abstract

An evaluation programme involving the extensive thermal cycling of component‐assembled printed circuit boards has been undertaken to assess the suitability of ESA‐approved hand‐soldering techniques for use on long‐life satellites. The modes of joint degradation are discussed and the metallurgical changes that result from material thermal expansion mismatch and repeated strain within the solder alloy (63% tin, 37% lead) are highlighted by photomicroscopy.

Citation

Dunn, B.D. (1979), "The Resistance of Space‐Quality Solder Joints to Thermal Fatigue: Part 2", Circuit World, Vol. 6 No. 1, pp. 16-27. https://doi.org/10.1108/eb043602