AN EFFICIENT ALGORITHM TO CALCULATE THE TEMPERATURE DISTRIBUTION AND THERMAL COUPLING ELEMENTS IN INTEGRATED CIRCUITS

Abstract

An efficient method is shown to calculate the temperature distribution and the thermal coupling elements in integrated circuits. With that it is possible to treat circuits under nonisothermal conditions. The algorithm combines several methods of the three‐dimensional solution of the FOURIER equation to analyse real heat problems of integrated circuits in a short computation time. Some examples illustrate the application of the algorithm.

Citation

ROEDIG, G. (1988), "AN EFFICIENT ALGORITHM TO CALCULATE THE TEMPERATURE DISTRIBUTION AND THERMAL COUPLING ELEMENTS IN INTEGRATED CIRCUITS", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 7 No. 4, pp. 207-215. https://doi.org/10.1108/eb010318