Electropolishing of copper plates in water‐acetone mixtures

Abstract

Reports on the determination of rates of electropolishing of copper by measuring the limiting current of anodic dissolution of copper in phosphoric acid and in (water‐acetone) ‐phosphoric acid mixtures. Notes that the rate of electropolishing is decreased in (water‐acetone) ‐phosphoric acid mixtures and that the percentage inhibition of dissolution depends on the mole fraction of acetone, and its dielectric constant. Concludes with calculation of the thermodynamic parameters of activation.

Citation

El‐Batouti, M. (1996), "Electropolishing of copper plates in water‐acetone mixtures", Anti-Corrosion Methods and Materials, Vol. 43 No. 4, pp. 27-33. https://doi.org/10.1108/eb007398