Keywords
Citation
(2003), "Advanced plating chemistry results in superior quality", Circuit World, Vol. 29 No. 2. https://doi.org/10.1108/cw.2003.21729bab.010
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Advanced plating chemistry results in superior quality
Advanced plating chemistry results in superior quality
Keywords: Speedboard, Copper plating
Speedboard has further increased the effectiveness and quality of its pattern plating capability with the installation of new copper plating chemistry at its Windsor facility. The improvements, made with the assistance of MacDermid and Fabtech, are part of the progressive EMS supplier’s ongoing investment program in all areas of its manufacturing processes.
HiSpec2 chemistry has been installed in all four of Speedboard’s 3,000 l copper plating tanks in response to the increasing demands being placed on the copper plating process as a result of more technologically advanced board designs. In conjunction with the new chemistry, the company has completed modifications that include top and bottom anode shielding, automated dosing and newly configured air sparges. The upgrades bring Speedboard’s copper plating facility in line with the most advanced, fully-automated technology in the industry.
For more information, please visit www.speedboard.co.uk