Siemens and Dynamic Details to develop green laser solutions for PCB manufacturing

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2001

82

Keywords

Citation

(2001), "Siemens and Dynamic Details to develop green laser solutions for PCB manufacturing", Circuit World, Vol. 27 No. 4. https://doi.org/10.1108/cw.2001.21727dad.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


Siemens and Dynamic Details to develop green laser solutions for PCB manufacturing

Siemens and Dynamic Details to develop green laser solutions for PCB manufacturing

Keywords: Siemens, Printed circuit boards, Manufacturing

Dynamic Details, Inc. (DDi) of Anaheim, California, and Siemens Substrate Technology, a division of Siemens Electronics Assembly Systems, Inc. of Norcross, Georgia, have joined forces to advance the use of green lasers in electronics manufacturing. The two companies will work jointly toward the goal of achieving PCB production rates three to four times faster than currently available with conventional lasers.

DDi, a leading provider of time-critical advanced interconnect solutions, will employ a Siemens MICROBEAM™ 3300 laser system to qualify the application of Siemens green lasers on FR4 glass-reinforced dielectrics and conventional RCC materials. As part of their relationships, DDi and Siemens are forming alliances with industry materials suppliers to obtain doped materials sets, which they will use to establish the solid-state, 532nm Siemens lasers as robust production tools for advanced package and PCB manufacturing. The project will be led by Ken Phillips, DDi's advanced technologies manager, who first introduced photovia and via drilling processes to the company's manufacturing operations.

Related articles