Keywords
Citation
(2001), "Patent application US6020049: product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes", Circuit World, Vol. 27 No. 4. https://doi.org/10.1108/cw.2001.21727dab.018
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Patent application US6020049: product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
Patent application US6020049: product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
Keywords: Patents, Laminates
A reinforced laminate that consists of conventional glass mesh, Teflon mesh, etc. with copper clad to one or both sides and a positive or negative acting photoimageable dielectric material impregnated in the mesh. This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimide, etc. The laminate construction will allow for via formation using established manufacturing methods for producing vias in printed circuits with minor process variations.
This product will eliminate major process steps such as mechanical drilling, laser drilling and plasma etching. It will allow most printed circuit producers the capability of producing complex multilayer circuits that are currently produced by relatively few circuit manufacturers. It eliminates processes such as plasma etching and laser processing and other capital-intensive methods that are currently in development or use. A further development as a result of this product allows for producing vias of any shape, e.g. square holes, elliptical holes, slots, etc. It also results in certain designs for producing solid metal vias, e.g. copper posts, which have higher conductivity and superior mechanical properties.
Danstep Associates of Salem, New Hampshire has been issued a Patent (#6,020,049) for products and processes for producing microvias. The company intends to exclusively license this technology to the industry this year. Interested parties can contact (e-mail preferred) A.J. Cucinotta at: Danstep Associates, 49 Pelham Road, Unit B, Salem, NH 03079. Tel: +1 (603) 893 7711; Fax: +1 (603) 894 7007; e-mail: friday38@mediaone.net