Citation
(2001), "HDlnterconnect Technology occupies new facility", Circuit World, Vol. 27 No. 4. https://doi.org/10.1108/cw.2001.21727dab.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
HDlnterconnect Technology occupies new facility
HDlnterconnect Technology occupies new facility
New facility for production of adhesiveless copper-on-polyimide flexible laminates
HDInterconnect Technology has taken occupancy of a new facility at 975 North Todd Avenue, Azusa, CA 91702, USA. The new facility provides 12,000 square feet of office and manufacturing space and will provide space for four production lines capable of producing several million square feet of adhesiveless copper-on-polyimide flexible laminate per year.