IPC EXPO preview

Citation

(2001), "IPC EXPO preview", Circuit World, Vol. 27 No. 3. https://doi.org/10.1108/cw.2001.21727cab.005

IPC EXPO preview

IPC EXPO preview

TDI productivity breaking through fine-line production barriers

CREO Ltd. will launch it's latest Thermal Laser Direct Imaging system, the DIamond-2428V at IPC EXPO (Plate 1). The introduction of this new production model will include live demonstrations of its imaging capabilities at the show.

The DIamond-2428V is CREO's latest Thermal Direct Imaging model offering improved productivity, superior accuracy and high yields of ultra-fine line and high-density PCBs. The new machine employs CREO's unique Thermal Direct Imaging (TDI) technology based on its proprietary 1/4 mil Square Spot™ laser heads that combines with CREO's DIfine-8L Thermal Liquid Etch Resist to deliver PCB fabricators unrivalled capabilities.

Plate 1 DIamond-2428V to be launched at IPC EXPO

The DIamond-2428V images CAM files directly onto panels coated with CREO's Thermal Liquid resist, avoiding cumbersome pre-patterning process stages. With no film and set-ups, turnaround times are shortened and costs are significantly reduced. The thermal liquid resist can be applied by CREO's integrated dip-coater/dryer, as well as with rollers-coaters.

CREO – Booth #1632

New A4a automated flying probe tester

The A4a, an automated flying probe tester from Everett Charles Technologies, will be demonstrated at IPC 2001. The double-sided test system for complex bare-board evaluations is the fastest flying prober in the field and offers extraordinary throughput for flying probe applications. Its advanced configuration, patented measurement method, and automation features are designed for qualifying up to a row of boards in tandem.

This is the latest model in the "A" Series (A2, A3) family of advanced testers has entered global distribution. Operating up to 16 moving probe heads made of ultra-light materials and featuring two alignment cameras, the A4a is a compact low-profile machine intended for middle size capacity production lines. It will be one of the interchangeable elements in an all-new sequential test platform from ECT, or may be ordered as a separate unit.

Everett Charles Technologies – Booth #3017

Zinc treatment enhances product program treatment processes in clean room area

The German company Schlenk Metallfolien GmbH & Co KG provides copper-treated and copper-zinc-treated foils in a thickness range from 0.01mm (10 microns) to 0.3mm (300 microns) and in widths ranging from 2mm (0,079") to 650mm (25.6"). These foils are available with single-sided or double-sided treatment and in Grades 5, 6, 7 and 8 (acc. to IPC-MF-150F).

Over the last ten years the company has specialised in rolling ultra-thin metal foils. The premier metal being rolled today is copper and some of its alloys (tombak, brass, bronze), resistance materials (copper-nickel). Other non-ferric metals such as pure nickel and pure silver foils are also rolled down to a minimum thickness of currently 0.0055mm (5.5 microns).

In addition to rolling metal foils Schlenk also has facilities available to enhance the performance of its foils by changing the physical surface characteristics by degreasing and roughening the metal. In-house technology enables fine-tuning of the surface appearance of the foils to the customer's requirements, anywhere between very rough and very shiny (Ra = 0.1 micron). Surface-claddings such as tin, aluminium and silver are also available. By the means of roll-cladding Schlenk can provide flux-free tinned copper foils with different tin-alloys, tin-thicknesses and in reflow-quality. Tinned copper foils are excellently suited for applications where soldering is to be performed.

Schlenk Metallfolien GmbH – Booth # 2155

M.E. Baker Series 2000 Lines

Series 2000 lines integrate space frame design, a choice of four hoists, and SPSMAN controls technology – including dynamic scheduling – from LUDY GmbH with I-STEM design and support equipment from M.E. Baker.

Series 2000 lines provide PCB fabricators with optimal process control and documentation in addition to critical processing capabilities such as plating high aspect ratio holes and blind and buried vias.

M.E. Baker Company – Booth # 2226