ENVISION® DMS-E direct metallization system introduced to North America

Citation

(1999), "ENVISION® DMS-E direct metallization system introduced to North America", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dad.012

ENVISION® DMS-E direct metallization system introduced to North America

ENVISION® DMS-E direct metallization system introduced to North America

Keywords: Enthone-OMI, Metallisation

The ENVISION® DMS-E direct metallization system was introduced to North American PWB fabricators at the IPC Printed Circuits Expo'99 by Enthone-OMl Inc. With over 100 installations worldwide, the conveyorized, horizontal direct metallization system selectively deposits highly conductive polymer on dielectric resin and glass areas without the use of electroless copper. Ideally suited for complex microvia designs, increasing layer counts, high aspect ratios and new materials, the system apparently provides fast, void-free plated through-hole metallization.

The ENVISION DMS-E system's selective activation system ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. A wide operating window allows for simplified process control and reduced process times. Yielding total process cost reduction, we are told that the system is suitable for all common laminate materials offering high process reliability and consistent results.

Details from Enthone-OMl Inc., P.O. Box 1900, New Haven, CT 06508, USA.