UV curable epoxide technology for the twenty-first century

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 1999

34

Keywords

Citation

(1999), "UV curable epoxide technology for the twenty-first century", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dad.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


UV curable epoxide technology for the twenty-first century

UV curable epoxide technology for the twenty-first century

Keywords: Jodan, Curing

Jodan Technology, Inc. has developed patent-pending technology that is designed for the improved, rapid processing of circuitry. Premier among Jodan's technology is a UL listable, UV curable screen coatable covercoat that it claims will save 75+ percent over the cost of laminating polyimide film during the preparation of flexible circuitry and can be used in dynamic as well as flex-to-install applications. The company has also developed the ability to screen coat and cure by UV highly filled silver epoxides resulting in very conductive films.

Advantages of UV curing, and particularly epoxide technology, include superior adhesion, minimal shrinkage upon cure, single component formulations, environmentally and worker friendly products among others. In particular, Jodan has developed low stress formulations for a variety of applications including covercoats, encapsulants, and electrically conductive coatings and adhesives.

For example, the JT series of products are being used commercially as covercoats in flexible and rigid-flex circuitry. These materials once cured rapidly by UV have an elongation of ca. 100 percent and adhere readily to FR-4, polyimide, and polyester. This series is also self-extinguishing and will not support combustion as a freestanding film allowing products to obtain UL listing.

In addition, Jodan has available UV curable conductive silver-based epoxide formulations. Screen coatable products with silver fill levels of 65 to 80 percent can be cured strictly by UV if so desired on substrates such as polyester, polyimide and paper. Suggested applications include EMI shielding, membrane switches, interconnects, conductive traces, adhesives, via-hole filling etc. Multiple curing processes are also feasible.

Details from Dr Stanley Jasne. Tel: +1 914 245 0194; Fax: +1 914 962 5923; E-mail: stanjasne@compuserve.com

Related articles