Keywords
Citation
(1999), "New European source for high integrity flex-rigid multilayer circuits", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
New European source for high integrity flex-rigid multilayer circuits
New European source for high integrity flex-rigid multilayer circuits
Keywords: Flextronic, Multi layers
A high integrity, flex-rigid multilayer circuit technology is available from Flextronic Limited which, it claims, far exceeds the performance capability of conventionally constructed circuits. Regal®Flex (rigid epoxy glass acrylic laminate) is a flex-rigid multilayer circuit solution which has been developed for complex circuits from six layers to 30 layers or more.
The combination of innovative manufacturing processes and utilization of high stability laminates virtually eliminates Z axis expansion which gives rise to "barrel cracking" and "pad lift". Typical applications for Regal Flex circuits include safety critical avionic equipment where absolute integrity is essential and high volume portable equipment such as laptop computers where size, weight, robustness and reliability are key factors.
Regal Flex circuits come in two constructional techniques, both offering the same level of high integrity. Regal 1 is a slightly lower cost construction generally utilized when the bend radii in the flexible circuit sections generally exceed 5mm and applications which are bend to install only and are non-dynamic.
Regal 5 is the construction used where the flexible circuit sections are required to bend through very tight radii or in applications which require frequent flexing of the circuit.
Both Regal 1 and Regal 5 constructions offer a high level of stability during the manufacturing and subsequent assembly processes, a benefit which derives from the low thermal co-efficient of expansion (TCE) of the materials employed. This results in far less stress in the circuit structure and is a major benefit in enabling very high layer count circuits to be produced with good layer to layer alignment.