IPC names Printed Circuits Expo technical program committee

Citation

(1999), "IPC names Printed Circuits Expo technical program committee", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dab.006

IPC names Printed Circuits Expo technical program committee

IPC names Printed Circuits Expo technical program committee

Keyword: IPC

IPC has announced its technical program committee for IPC Printed Circuits Expo 2000, taking place 2-6 April 2000, at the San Diego Convention Center in San Diego, California.

The committee will comprise 14 individuals who will select and organize the papers being presented at the Printed Circuits Expo technical conference. Twelve of the committee members represent various segments of the printed wiring board industry:

1. 1.

   Linda Self (Chair) - Director of Marketing, Litton.

2. 2.

   Ed Kelly - Technical Director, Compositech Ltd.

3. 3.

   Doug Sober - Corporate Director of Quality, IsolaUSA.

4. 4.

   Cef Gonzalez - OEM & Product Applications, E.I. Du Pont de Nemours.

5. 5.

   Gene Weiner - President & CEO, Weiner & Associates Inc.

6. 6.

   Foster Gray - Consultant, PC Interconnects.

7. 7.

   Jack Fisher - Chief Technical Officer, ITRI.

8. 8.

   Tom Gardeski -Sr Technical Manager, E.I. Du Pont de Nemours & Co.

9. 9.

   John Sharp - EHS Manager, Teradyne Connection System.

10. 10.

    Michael Carano - VP of Marketing, Strategic Devl., Electrochemicals Inc.

11. 11.

    Brian McDermott - Director of Advanced Technology, MicroVia.

12. 12.

    Pat Kane - Education/Training Admin., Diversified Systems Inc.

Two members from the industry's trade magazines are also represented on the committee:

1. 1.

   Bill Foran -Editor-in-Chief, Printed Circuit Fabrication.

2. 2.

   Ray Rasmussen -Publisher, Editor, Circuitree.

"We want the IPC Printed Circuits Expo 2000 technical conference to highlight the latest technologies that are impacting the industry," says IPC director of PWB industry programs Jean Hebeisen. "The people who have agreed to serve on our program committee have the background and ability to put together that type of conference."

The primary focus for the IPC Printed Circuits Expo technical conference will be on methods of increasing interconnect density at the PCB level. Specific topics being addressed include buried resistance and capacitance, base material alternatives, and microvia technologies.

For information on presenting a paper at the IPC Printed Circuits Expo technical conference, contact Stephannie Caliendo at +1 (847) 790 5302 or e-mail calist@ipc.org. For information on attending, call IPC registration at +1 (847) 790 5361, or visit the IPC Web site at http://www.ipcprintedcircuitsexpo.org