Citation
(1999), "Literati Awards for Excellence", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725daa.001
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Literati Awards for Excellence
Literati Awards for Excellence
On 26 April 1999, MCB University Press held its annual Awards for Excellence and Editors' workshop at the Hilton National London Olympia hotel, UK. Editors of many of MCB's journals attended an afternoon workshop where various topics were discussed including International Research Registers (go to http://www.mcb.co.uk/ literati/research_registers/ for further details), copyright, the role of the publisher and quality of publications. The workshop was followed by an award ceremony where authors of the most outstanding papers from the 1998 volume for each journal were recognised and presented with a plaque by the guest of honour, the Reverend Graham Cornish who is responsible for copyright law within the British Library Document Supply Centre (BLDSC). The awards for Circuit World went to Yun Zhang and Joseph A. Abys of Electroplating Chemicals and Services, Lucent Technologies, New Jersey, USA, for their paper, "A unique electroplating tin chemistry", Vol. 25 No. 1, and to Paul T. Vianco of Sandia National Laboratories, New Mexico, USA for his paper, "An overview of surface finishes and their role in printed circuit board solderability and solder joint performance", Vol. 25 No. 1. Yun Zhang and Charles Dunning (on behalf of Joseph Abys) collected their award (Plate 1). Unfortunately, Paul Vianco was unable to make the trip to the UK and his award was posted on.
Plate 1Charles Dunning (on behalf of
Joseph Abys) and Yun Zhang receive their award from the Reverend Cornish
The authors' awards were followed by awards for Leading Editors and finally for the Editor of the Year, which went to Patricia Layzell-Ward, the editor of Library Management. Brian Ellis was awarded "Internet Editor of the Year" in recognition of his outstanding contributions to Circuit World, Soldering and Surface Mount Technology and Microelectronics International in the form of his Internet Commentaries.
The ceremony was followed by a champagne reception and a dinner for all the winning authors, editors, guests and MCB editorial staff. It was a wonderful event and a very productive evening. Many of the attendees said that it was very useful to meet up with fellow authors and editors, both in their own fields and from other disciplines. We at MCB found it a great help to be able to put some names to faces. It was good to meet up with old acquaintances and to make some new ones. We look forward to next year's event.
Cathy AplinManaging Editor
The winning papers and authors
"A unique electroplating tin chemistry", Circuit World, Vol. 25 No. 1 (October 1998) Yun Zhang and Joseph A. Abys, Electroplating Chemicals and Services, Lucent Technologies, Murray Hill, New Jersey, USA
Dr Yun Zhang is a project leader at Lucent Technologies, Electroplating Chemicals and Services. She holds a PhD in inorganic electrochemistry from Brown University, USA. Her main interest is to understand electrodeposition phenomenon at a molecular level and to develop environmental benign, novel base-metal electroplating chemistries/processes. She has authored 18 publications and a book chapter. She holds one US patent with two others pending.
Dr Joseph A. Abys is the president of Lucent Technologies, Electroplating Chemicals and Services, a New Venture organisation located in Murray Hill, New Jersey. He received a PhD in physical inorganic chemistry from Brown University, USA and has been working in the field of electrodeposition for 19 years, with a concentration on the plating of palladium and its alloys. Dr Abys has authored three book chapters and more than 50 technical publications. In addition, he has been granted more than 35 patents in the USA and abroad. He has received numerous awards throughout his professional career. He was inducted into the New Jersey Inventors Hall of Fame in 1998.
"An overview of surface finishes and their role in printed circuit board solderability and solder joint performance", Circuit World, Vol. 25 No. 1 (October 1998) Paul T. Vianco, Sandia National Laboratories, Albuquerque, New Mexico, USA
Dr Paul Vianco received a PhD degree in Materials Science from the University of Rochester (New York) in 1986. He joined Sandia National Laboratories, Albuquerque, New Mexico in 1987 and is currently a principal member of the technical staff. Paul has been involved in all aspects of soldering technology, including alloy and process development efforts for Pb-free solders, the use of ultra-thin solder joints for microsensor assembly, and the modeling of thermal mechanical fatigue in solder joints. Of particular interest has been the development and experimental validation of a multi-dimensional model that predicts the solid-state growth of intermetallic compound layers in solder joints. An area of continued investigation by Dr Vianco has been determining the reliability of thick film hybrid microcircuits and similar technologies that use low-temperature, co-fired ceramics. He is a member of the technical committee of the Surface Mount Technology Association and holds the position of second co-chairman of the Brazing and Soldering Sub-Committee of the American Welding Society. Paul also remains active in the American Society for Materials, International.