A new solvent-free dispersing additive – for waterborne, solventborne and radiation-curing formulations

Anti-Corrosion Methods and Materials

ISSN: 0003-5599

Article publication date: 1 May 2006

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Keywords

Citation

(2006), "A new solvent-free dispersing additive – for waterborne, solventborne and radiation-curing formulations", Anti-Corrosion Methods and Materials, Vol. 53 No. 3. https://doi.org/10.1108/acmm.2006.12853cad.001

Publisher

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Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited


A new solvent-free dispersing additive – for waterborne, solventborne and radiation-curing formulations

A new solvent-free dispersing additive – for waterborne, solventborne and radiation-curing formulations

Keywords: Pigments, Materials management

TEGO® Dispers 655 stabilizes and improves the wetting of many types of inorganic pigments and fillers. It gives outstanding results particularly with transparent iron oxides and aluminium pigments.

By using TEGO® Dispers 655 in the production of either resin-containing dispersions or pigment concentrates it is possible to reduce viscosity and achieve outstanding color strength, high gloss and superior storage stability.

As with all our wetting and dispersing additives, TEGO® Dispers 655 is free of alkylphenolethoxylates.

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