IRphotonics' thermal spot curing system reduces epoxy-curing time by up to 10x

Citation

(2010), "IRphotonics' thermal spot curing system reduces epoxy-curing time by up to 10x", Assembly Automation, Vol. 30 No. 1. https://doi.org/10.1108/aa.2010.03330aad.003

IRphotonics' thermal spot curing system reduces epoxy-curing time by up to 10x

Article Type: New products From: Assembly Automation, Volume 30, Issue 1

IRphotonics, a leader in the design, manufacture and marketing of infrared-based materials and systems announces ground-breaking results of independent product evaluations by leading medical device manufacturers for its iCure™ infrared spot curing system (Figure 1).

Figure 1 The iCure™ Infrared spot curing system

One product evaluation performed by a medical device manufacturer, using electrically conductive adhesive, H20E from Epoxy Technology, Inc. was conducted in order to reduce the curing time of their medical device assembly. The adhesive manufacturer's recommended cure schedule of 120°C for 15 min in a thermal oven was dramatically reduced to a 1 min cure using the iCure AS200 thermal spot curing system.

Another product evaluation was subsequently conducted with a high-temperature adhesive 353ND, also from Epoxy Technology, for sealing electromechanical sub components of a disposable medical device. The adhesive manufacturer's recommended cure schedule of 120 °C for 10 min using a thermal oven was reduced to 20 s with the iCure AS200 thermal spot curing system.

The iCure AS200 is a revolutionary inline fiber optic system that provides heat by infrared radiation in a portable unit, delivering pinpoint and accurate control for temperature sensitive substrates and complex devices. Using infrared light to generate heat, the iCure thermal spot curing system is tailor-made for automated manufacturing processes requiring rapid adhesive curing and localized heating of bonded assemblies.