Dual-plane miniature planar 3D ECT sensor based on 3 × 3 matrix electrode array
ISSN: 0260-2288
Article publication date: 25 October 2023
Issue publication date: 21 November 2023
Abstract
Purpose
As one of the tomographic imaging techniques, electrical capacitance tomography (ECT) is widely used in many industrial applications. While most ECT sensors have electrodes placed around a cylindrical chamber, the planar ECT sensor has been investigated for depth and defect detection. However, the planar ECT sensor has limited height and depth sensing capability due to its single-sided assessment with the use of only a single-plane design. The purpose of this paper is to investigate a dual-plane miniature planar 3D ECT sensor design using the 3 × 3 matrix electrode array.
Design/methodology/approach
The sensitivity map of dual-plane miniature planar 3D ECT sensor was analysed using 3D visualisation, the singular value decomposition and the axial resolution analysis. Then, the sensor was fabricated for performance analysis based on 3D imaging experiments.
Findings
The sensitivity map analysis showed that the dual-plane miniature planar 3D ECT sensor has enhanced the height sensing capability, and it is less ill-posed in 3D image reconstruction. The dual-plane miniature planar 3D ECT sensor showed a 28% improvement in reconstructed 3D image quality as compared to the single-plane sensor set-up.
Originality/value
The 3 × 3 matrix electrode array has been proposed to use only the necessary electrode pair combinations for image reconstruction. Besides, the increase in number of electrodes from the dual-plane sensor setup improved the height reconstruction of the test sample.
Keywords
Acknowledgements
This study was supported by Ministry of Higher Education Malaysia and Universiti Teknologi Malaysia through FRGS project code: FRGS/1/2020/TK0/UTM/02/47.
Citation
Gooi, W.P., Leow, P.L., Pusppanathan, J., Hor, X.F. and Mohammad Din, S. (2023), "Dual-plane miniature planar 3D ECT sensor based on 3 × 3 matrix electrode array", Sensor Review, Vol. 43 No. 5/6, pp. 369-378. https://doi.org/10.1108/SR-06-2023-0240
Publisher
:Emerald Publishing Limited
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