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Temperature distribution simulations during electron beam freeform fabrication process based on the fully threaded tree

Yajun Yin, Wei Duan, Kai Wu, Yangdong Li, Jianxin Zhou, Xu Shen, Min Wang

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 28 June 2019

Issue publication date: 21 August 2019

148

Abstract

Purpose

The purpose of this study is to simulate the temperature distribution during an electron beam freeform fabrication (EBF3) process based on a fully threaded tree (FTT) technique in various scales and to analyze the temperature variation with time in different regions of the part.

Design/methodology/approach

This study presented a revised model for the temperature simulation in the EBF3 process. The FTT technique was then adopted as an adaptive grid strategy in the simulation. Based on the simulation results, an analysis regarding the temperature distribution of a circular deposit and substrate was performed.

Findings

The FTT technique was successfully adopted in the simulation of the temperature field during the EBF3 process. The temperature bands and oscillating temperature curves appeared in the deposit and substrate.

Originality/value

The FTT technique was introduced into the numerical simulation of an additive manufacturing process. The efficiency of the process was improved, and the FTT technique was convenient for the 3D simulations and multi-pass deposits.

Keywords

Acknowledgements

This research was financially supported by the National Natural Science Foundation of China (No. 51305149), Horizon 2020 “Efficient Manufacturing for Aerospace Components USing Additive Manufacturing, Net Shape HIP and Investment Casting (EMUSIC)” (No. MJ-2015-H-G-104) and National Science & Technology Key Projects of Numerical Control (2012ZX04012-011).

Citation

Yin, Y., Duan, W., Wu, K., Li, Y., Zhou, J., Shen, X. and Wang, M. (2019), "Temperature distribution simulations during electron beam freeform fabrication process based on the fully threaded tree", Rapid Prototyping Journal, Vol. 25 No. 6, pp. 989-997. https://doi.org/10.1108/RPJ-12-2016-0211

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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