Predictive modeling for online in-plane shape deviation inspection and compensation of additive manufacturing
ISSN: 1355-2546
Article publication date: 1 December 2023
Issue publication date: 7 February 2024
Abstract
Purpose
Limited geometric accuracy is one of the major challenges that hinder the wider application of additive manufacturing (AM). This paper aims to predict in-plane shape deviation for online inspection and compensation to prevent error accumulation and improve shape fidelity in AM.
Design/methodology/approach
A sequence-to-sequence model with an attention mechanism (Seq2Seq+Attention) is proposed and implemented to predict subsequent layers or the occluded toolpath deviations after the multiresolution alignment. A shape compensation plan can be performed for the large deviation predicted.
Findings
The proposed Seq2Seq+Attention model is able to provide consistent prediction accuracy. The compensation plan proposed based on the predicted deviation can significantly improve the printing fidelity for those layers detected with large deviations.
Practical implications
Based on the experiments conducted on the knee joint samples, the proposed method outperforms the other three machine learning methods for both subsequent layer and occluded toolpath deviation prediction.
Originality/value
This work fills a research gap for predicting in-plane deviation not only for subsequent layers but also for occluded paths due to the missing scanning measurements. It is also combined with the multiresolution alignment and change point detection to determine the necessity of a compensation plan with updated G-code.
Keywords
Acknowledgements
This work was funded by Research Foundation of SUNY Award 61476. The authors would like to thank the editors and anonymous referees for their valuable comments that improved the quality of this article.
Citation
Wang, H., Al Shraida, H. and Jin, Y. (2024), "Predictive modeling for online in-plane shape deviation inspection and compensation of additive manufacturing", Rapid Prototyping Journal, Vol. 30 No. 2, pp. 350-363. https://doi.org/10.1108/RPJ-03-2023-0076
Publisher
:Emerald Publishing Limited
Copyright © 2023, Emerald Publishing Limited