Wall slip effects in Rayleigh–Bénard convection of viscoplastic materials
Multidiscipline Modeling in Materials and Structures
ISSN: 1573-6105
Article publication date: 13 October 2023
Issue publication date: 13 November 2023
Abstract
Purpose
According to the research, viscoplastic fluids are sensitive to slipping. The purpose of this study is to determine whether slip affects the Rayleigh–Bénard convection of viscoplastic fluids in cavities and, if so, under what conditions.
Design/methodology/approach
The wall slip was evaluated using a model created for viscoplastic (Bingham) fluids. The coupled conservation equations were solved numerically using the finite element method. Simulations were performed for various parameters: the Rayleigh number, yield number, slip yield number and friction number.
Findings
Wall slip determines two essential yield stresses: a specific yield stress value beyond which wall slippage is impossible (S_Yc); and a maximum yield stress beyond which convective flow is impossible (Y_c). At low Rayleigh numbers, Y_c is smaller than S_Yc. Hence, the flow attained a stable (conduction) condition before achieving the no-slip condition. However, for more significant Rayleigh numbers Y_c exceeded S_Yc. Thus, the flow will slip at low yield numbers while remaining no-slip at high yield numbers. The possibility of slipping on the wall increases the buoyancy force, facilitating the onset of Rayleigh–Bénard convection.
Originality/value
An essential aspect of this study lies in its comprehensive examination of the effect of slippage on the natural convection flow of viscoplastic materials within a cavity, which has not been previously investigated. This research contributes to a new understanding of the viscoplastic fluid behavior resulting from slipping.
Keywords
Citation
Aghighi, M.S., Metivier, C. and Fakhri, S. (2023), "Wall slip effects in Rayleigh–Bénard convection of viscoplastic materials", Multidiscipline Modeling in Materials and Structures, Vol. 19 No. 6, pp. 1275-1290. https://doi.org/10.1108/MMMS-05-2023-0185
Publisher
:Emerald Publishing Limited
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