To read this content please select one of the options below:

(excl. tax) 30 days to view and download

Data acquisition and processing circuit for high-temperature logging up to 200°C

Jingxuan Peng, Jingjing Cheng, Lei Wu, Qiong Li

Microelectronics International

ISSN: 1356-5362

Article publication date: 27 March 2020

Issue publication date: 11 June 2020

166

Abstract

Purpose

This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging.

Design/methodology/approach

With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation.

Findings

In thermal simulation, considering on board chips’ power consumption as additional heat source, the highest temperature point reached by all the chips in the circuit is only 211 °C at work temperature of 200 °C. In addition, the proposed circuit was validated by long time high-temperature experiments. The circuit showed good dynamic performance during a 4-h test in a 200-°C oven, and maintained a signal-to-noise ratio of 92.54 dB, a signal-to-noise and distortion ratio of 91.81 dB, a total harmonic distortion of −99.89 dB and a spurious free dynamic range of 100.28 dB.

Originality/value

The proposed circuit and methodology showed great potential for application in deep-well logging systems and other high-temperature situations.

Keywords

Citation

Peng, J., Cheng, J., Wu, L. and Li, Q. (2020), "Data acquisition and processing circuit for high-temperature logging up to 200°C", Microelectronics International, Vol. 37 No. 3, pp. 131-138. https://doi.org/10.1108/MI-09-2019-0059

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

Related articles