Modelling mutual thermal coupling in LED modules
Abstract
Purpose
The purpose of this paper is to present an electrothermal model of the module containing power light emitting diodes (LEDs) situated on a common base.
Design/methodology/approach
The electrothermal model of this device, which takes into account both self-heating and mutual thermal coupling between the diodes situated in this module, is described.
Findings
The correctness of the presented model is verified experimentally, and a good agreement of the calculated and measured optical and thermal characteristics of the considered module is obtained.
Research limitations/implications
The presented model can be used for different structures of the LED module, but electrical inertia in the diodes is omitted.
Practical implications
The presented model was used to calculate electrical, thermal and optical waveforms of the module OSPR3XW1 containing three power LED situated on the common base.
Originality/value
The presented model takes into account thermal inertia in the considered LED module and its cooling systems with mutual thermal coupling between all the diodes situated in the same module.
Keywords
Citation
Górecki, K. and Ptak, P. (2015), "Modelling mutual thermal coupling in LED modules", Microelectronics International, Vol. 32 No. 3, pp. 152-157. https://doi.org/10.1108/MI-01-2015-0013
Publisher
:Emerald Group Publishing Limited
Copyright © 2015, Emerald Group Publishing Limited