Investigating the link between intellectual capital and open innovation processes: a longitudinal case study
Journal of Intellectual Capital
ISSN: 1469-1930
Article publication date: 3 December 2020
Issue publication date: 24 March 2022
Abstract
Purpose
This paper investigates the link between Intellectual Capital (IC) and Open Innovation (OI). Scholars worldwide consider the topics as standing alone and so they give scarce attention to the possible link between them. Managerial experiences (and few theoretical contributions), instead, hypothesize a significant role that IC can play over OI processes in order make them successful.
Design/methodology/approach
The methodology of a single case study is used to investigate the link between IC and OI. In particular, an OI process managed by a global company, LEGO, and named Mindstorms is rebuilt and analysed herein.
Findings
Intermediate results achieved by LEGO through its OI process were unsuccessful since the company had not developed its own IC (made up of relational, human and structural capital). The subsequent development of IC, instead, has driven to successful results. This suggests that if companies do not develop their IC before launching OI processes, then these processes might be not successful.
Research limitations/implications
One limitation is the use of a single case study. Despite this, the present article is a warning for all the companies: before launching OI processes they need to develop their IC.
Originality/value
To the best knowledge of the authors, this is one of the first works that deepens the investigation of the link between IC and OI. Very often, scholars investigating IC shyly refer to OI, without mentioning it, while the scholars investigating OI allude to IC, without citing it. In this study, IC and OI are investigated together.
Keywords
Citation
Matricano, D., Candelo, E., Sorrentino, M. and Cappiello, G. (2022), "Investigating the link between intellectual capital and open innovation processes: a longitudinal case study", Journal of Intellectual Capital, Vol. 23 No. 3, pp. 538-557. https://doi.org/10.1108/JIC-02-2020-0020
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited