Citation
(2013), "Announcement for ThermaComp 2014", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 23 No. 8. https://doi.org/10.1108/HFF-11-2013-001
Publisher
:Emerald Group Publishing Limited
Announcement for ThermaComp 2014
Article Type: Conference announcement From: International Journal of Numerical Methods for Heat & Fluid Flow, Volume 23, Issue 8
Third International Conference on Computational Methods for Thermal Problems (ThermaComp2014), Lake Bled, Slovenia, June 2-4, 2014
About ThermaComp
Between 1979 and 1997 a number of meetings on computational thermal problems were organised by Professor Roland W. Lewis and his colleagues.
Since then, the world energy situation has become critical and new issues are arising in the sector of energy conversion. Many of these issues are strictly related to thermal problems, and the possibility to solve these problems efficiently is very often related to the new developments in Computational Techniques. Thermal problems are also rising in new areas of research, such as bioengineering and nanotechnology, where new models and solution methods need to be developed.
The International Conference on Computational Methods for Thermal Problems aims at bringing together researchers, scientists, practitioners and students interested in this area of research in order to discuss the most recent developments and the challenges that the future holds in this field.
Technical papers are invited on any topics related to Computational Methods for Thermal Problems. Proposals are also invited for mini-symposia organised by individual researchers (composed of at least five papers).
A special award for the best post-graduate student presentation will be awarded to honour the outstanding contributions and service of Professor Roland W. Lewis to computational heat transfer.
Topics
Check and update the topics list:
* conduction, convection and radiation;
* coupled problems;
* reactive heat and mass transport;
* heat and mass transfer in porous media;
* numerical methods;
* high performance computing;
* biological heat and mass transfer;
* heat exchangers and fuel cells;
* boiling and condensation;
* power plants and equipment;
* energy conversion;
* refrigeration and air-conditioning;
* chemical processes and heat transfer; and
* micro- and nano-heat transport.
Chairs and committees
Honorary Chair
Professor Roland W. Lewis, Swansea University, UK
Co-chairs
B. Sarler, University of Nova Gorica, Slovenia
N. Massarotti, Università di Napoli “Parthenope, Italy
P. Nithiarasu, Swansea University, UK
Executive Committee
P. Cheng, Shanghai Jiao Tong University, China
G. Comini, Università di Udine, Italy
Y. Jaluria, Rutgers, The State University of New Jersey, USA
X.K. Li, Dalian University of Technology, China
V. Naso, Università di Napoli Federico II, Italy
K.N. Seetharamu, PES Institute of Technology, India
B. Sunden, Lund University, Sweden
K. Vafai, University of California, Riverside, USA
International Advisory Committee
F. Arpino, Università di Cassino, Italy
B.R. Baliga, McGill University, Canada
S.W. Baek, Korea Advanced Institute of Science & Technology, South Korea
G. Biswas, Indian Institute of Technology Kanpur, India
A. Carotenuto, Università di Napoli “Parthenope, Italy
A.J. Chamkha, Public Authority for Applied Education and Training, Kuwait
S. Chang, National University of Singapore, Singapore
F. Chinesta, Ecole Centrale de Nantes, France
R. Codina, Universitat Politècnica de Catalunya, Spain
H. Combeau, Ecole des Mines de Nancy, France
R.M. Cotta, Universidade Federal do Rio de Janeiro, Brazil
D. Drikakis, Cranfield University, UK
D. Givoli, Technion – Israel Institute of Technology, Israel
D. Gobin, CNRS, France
S. Idelsohn, Instituto de Desarrollo Tecnologico para la Industria Quimica, Argentina
Y. Joshi, Georgia Institute of Technology, USA
A. Kassab, University of Central Florida, USA
M. Li, Taiyuan University of Technology, China
R. Lohner, George Mason University, USA
A.G. Malan, Council for Scientific and Industrial Research, South Africa
O. Manca, Seconda Università di Napoli, Italy
J.C. Mandal, Indian Institute of Technology Bombay, India
C. Meola, Università di Napoli Federico II, Italy
C. Nonino, Università di Udine, Italy
A.J. Nowak, Silesian Polytechnic University, Poland
J. Patterson, University of Sydney, Australia
I. Pop, University of Cluj, Romania
J. Reese, University of Strathclyde Glasgow, UK
W. Shyy, Hong Kong University of Science and Technology, Hong Kong
Siraj-ul-Islam, University of Engineering and Technology Peshawar, Pakistan
B.A. Schrefler, Università di Padova, Italy
V.R. Voller, University of Minnesota, USA
I. Vusanovic, University of Montenegro, Montenegro
W. Wall, Technische Universität München, Germany
Awards and journals
Professor Roland W. Lewis prize will be awarded to the best postgraduate student presentation. The prize includes €500 and a certificate. The winner will be invited to submit an expanded version of his/her paper to the International Journal of Numerical Methods for Heat and Fluid Flow.
Three runner-up certificates will also be presented along with invitations to submit an extended version of their papers to the journal.
Approximately eight Zienkiewicz fellowships are available for PhD students and post-doctoral fellows. If you are interested in applying for one of these fellowships, please send your CV and your ThermaComp2014 abstract to Professor Nithiarasu (mailto:P.Nithiarasu@swansea.ac.uk). The scholarship covers the full registration fee of the successful applicants.
Authors of high quality papers will be asked to submit full length papers to special issues of the International Journal of Numerical Methods for Heat and Fluid Flow.
Deadlines
Mini-symposium proposal submission – October 21, 2013
Extended abstract submission – December 15, 2013
Notification of acceptance – February 15, 2014
Final extended abstract submission – March 15, 2014
Early bird registration – March 15, 2014
Final registration – May 15, 2014
Abstract submission
Dr A. Mauro, e-mail: mailto:alessandro.mauro@uniparthenope.it