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Integral attachment using snap‐fit features: a key to assembly automation. Part 2 ‐ bringing order to integral attachment: attachment‐level design

Robert W. Messler (Associate Professor and Director of the Materials Joining Laboratory in the Materials Science and Engineering Department, Rensselaer Polytechnic Institute, Troy, New York, USA)
Suat Genc (PhD candidate in mechanical engineering in the Department of Mechanical Engineering, Aeronautical Engineering and Mechanics under the co‐advisement of Drs Messler and Gabriele, Rensselaer Polytechnic Institute, Troy, New York, USA)
Gary A. Gabriele (Professor in the Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, as well as Associate Dean of the School of Engineering, Rensselaer Polytechnic Institute, Troy, New York, USA)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 June 1997

592

Abstract

This second of a six‐part series presents a hierarchical scheme for classifying integral snap‐fits at the attachment level, bringing great order to where there appeared to be chaos. The scheme is then used to enumerate all possible design options. The proliferation of plastic parts, and the ability to mould such parts of great complexity at little cost penalty, has resulted in the growing use of integral attachment in the form of snap‐fit features in designs. Heretofore, the great diversity of part geometry and integral snap‐fit features has made it appear that design possibilities may be unbounded, and that attempts at optimization might be intractable. The result shows that options can quickly be reduced to a small enough number to allow designers to compare every possibility, thereby making true optimization a practical reality. As such, the scheme guides new designers and validates choices for experienced designers in ways never before possible.

Keywords

Citation

Messler, R.W., Genc, S. and Gabriele, G.A. (1997), "Integral attachment using snap‐fit features: a key to assembly automation. Part 2 ‐ bringing order to integral attachment: attachment‐level design", Assembly Automation, Vol. 17 No. 2, pp. 156-165. https://doi.org/10.1108/EUM0000000004328

Publisher

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MCB UP Ltd

Copyright © 1997, MCB UP Limited

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