OpenMP-based parallel MLPG solver for analysis of heat conduction
ISSN: 0264-4401
Article publication date: 5 April 2024
Issue publication date: 16 April 2024
Abstract
Purpose
In the present work, we focus on developing an in-house parallel meshless local Petrov-Galerkin (MLPG) code for the analysis of heat conduction in two-dimensional and three-dimensional regular as well as complex geometries.
Design/methodology/approach
The parallel MLPG code has been implemented using open multi-processing (OpenMP) application programming interface (API) on the shared memory multicore CPU architecture. Numerical simulations have been performed to find the critical regions of the serial code, and an OpenMP-based parallel MLPG code is developed, considering the critical regions of the sequential code.
Findings
Based on performance parameters such as speed-up and parallel efficiency, the credibility of the parallelization procedure has been established. Maximum speed-up and parallel efficiency are 10.94 and 0.92 for regular three-dimensional geometry (343,000 nodes). Results demonstrate the suitability of parallelization for larger nodes as parallel efficiency and speed-up are more for the larger nodes.
Originality/value
Few attempts have been made in parallel implementation of the MLPG method for solving large-scale industrial problems. Although the literature suggests that message-passing interface (MPI) based parallel MLPG codes have been developed, the OpenMP model has rarely been touched. This work is an attempt at the development of OpenMP-based parallel MLPG code for the very first time.
Keywords
Acknowledgements
Authors gratefully acknowledge the use of computational facilities of CFD Lab., MIED, IIT-Roorkee established with the FIST grant (DST-354-MID) from DST, Government of India, and Grant No. HIL-1454-MID funded by Hitachi India Ltd.
Citation
Singh, A.K. and Singh, K.M. (2024), "OpenMP-based parallel MLPG solver for analysis of heat conduction", Engineering Computations, Vol. 41 No. 2, pp. 364-384. https://doi.org/10.1108/EC-01-2023-0012
Publisher
:Emerald Publishing Limited
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