Study on process technique of PCBs with ladder conductive lines

Abstract

Purpose

This paper aims to develop an ideal technique for the preparation of print circuit boards (PCBs) with ladder conductive lines on practical industrial process lines.

Design/methodology/approach

First, the raw materials of ladder copper-clad laminates were prepared by plating double-sided copper-clad laminates with vertical plating line. Second, etching compensation experiments were designed and conducted to set up the relationships between etching compensation and width of conductive lines on ladder line print circuit boards (LLPCBs). Third, to evaluate the process technique for the preparation of LLPCBs through etching compensation, verification experiments were designed and conducted on a practical industrial process line, and the quality of lines on LLPCBs was observed and evaluated.

Findings

Under the judgment of the quality of conductive lines on LLPCBs as well as the feasibility with a practical industrial process line, the process technique for the preparation of LLPCBs with etching compensation is a simple and reliable method which has the potential to be applied in the industry.

Originality/value

It is the first successful report of a new method that produces LLPCBs with etching compensation and has the potential to be applied in the industry.

Citation

Li, X., Liu, J., Zhang, S., He, W., Chen, S., Li, Z. and Chen, J. (2015), "Study on process technique of PCBs with ladder conductive lines", Circuit World, Vol. 41 No. 1, pp. 34-40. https://doi.org/10.1108/CW-09-2014-0036