Characterization of PCB routing process and optimization of tool design based on the investigation of routing temperature
Abstract
Purpose
The purpose of this paper is to provide the method and system to conduct online measurement and the characterization of temperature during printed circuit board (PCB) routing process as well as the optimization of router design based on the investigation of routing temperature.
Design/methodology/approach
The background of this research is introduced first. Then the method to measure the routing temperature on-line by using an infrared camera is presented. The routing process is characterized by investigating the routing temperature. Tool design optimization is conducted based on the temperature in processing PCB with aluminum substrate. Finally the concluding remarks of this research are presented.
Findings
The routing temperature can be accurately measured by an infrared camera. Routing temperature is sensitive to properties of PCB, types of router and routing parameters. Very high temperature is experienced if non-appropriate routers are used to process board with aluminum substrate. It is demonstrated by the experiments that two fluted tool, three fluted tool and coated tool with three flutes are suitable for aluminum substrate processing by considering the low temperature and the nice surface finish.
Originality/value
The paper highlights the key points to measure the routing temperature on-line by an infrared camera and characterize the routing process and optimize the tool design by investigating the measured temperature as well.
Keywords
Acknowledgements
This research was funded by the Project of Research on Key Technologies of Strategic Innovative Industry, Guangdong Province under grant number 2012A090100012 (00367250185047081).
Citation
Fu, L., Wang, J. and Guo, Q. (2013), "Characterization of PCB routing process and optimization of tool design based on the investigation of routing temperature", Circuit World, Vol. 39 No. 4, pp. 212-216. https://doi.org/10.1108/CW-08-2013-0026
Publisher
:Emerald Group Publishing Limited
Copyright © 2013, Emerald Group Publishing Limited