Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm

Abstract

Purpose

The purpose of this paper is to analyze and figure out the temperature field and thermal stress field with the calculation model of thermal insulation material and composite material.

Design/methodology/approach

The paper adopted the three-dimensional finite element algorithm.

Findings

The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board. The reasonable distribution of chip will effectively reduce the temperature extremum and stress extremum of circuit board.

Originality/value

The paper analyzes and presents a discussion of the problems relating to the density of electronic packaging. The analysis process and the method of the paper provide essential help in resolving electronic device heat problems.

Citation

Song, L., Zhao , Y., Zhou , Y. and Xiang, H. (2015), "Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm", Circuit World, Vol. 41 No. 2, pp. 49-54. https://doi.org/10.1108/CW-07-2014-0024