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Fractal model of thermal contact conductance of rough surfaces based on axisymmetric cosinusoidal asperity

Xianguang Sun (College of Sciences, Northeastern University, Shenyang, China)
Xicheng Xin (State Key Laboratory of Engine Reliability, Weichai Power Co., Ltd, Weifang, China)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 14 December 2023

Issue publication date: 1 March 2024

79

Abstract

Purpose

The purpose of this study is to propose a fractal model of thermal contact conductance of rough surfaces based on axisymmetric cosinusoidal asperity.

Design/methodology/approach

The effects of contact load, fractal dimension, fractal roughness and friction coefficient on the thermal contact conductance of rough surfaces were investigated in this study.

Findings

The findings suggest that as the contact load increases, the thermal contact conductance of rough surfaces also increases. In addition, an increase in the fractal dimension corresponds to an increase in the thermal contact conductance. Conversely, an increase in fractal roughness leads to a decrease in thermal contact conductance. The smaller the friction coefficient, the lower the thermal contact conductance of the rough surface. In practical engineering applications, it is possible to achieve the desired thermal contact conductance of rough surfaces by selecting surfaces with appropriate roughness.

Originality/value

A fractal model of thermal contact conductance of rough surfaces based on axisymmetric cosinusoidal asperity was established in this study. The findings of this study offer a theoretical foundation for investigating the thermal contact conductance of rough surfaces.

Keywords

Citation

Sun, X. and Xin, X. (2024), "Fractal model of thermal contact conductance of rough surfaces based on axisymmetric cosinusoidal asperity", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 43 No. 1, pp. 80-93. https://doi.org/10.1108/COMPEL-09-2023-0401

Publisher

:

Emerald Publishing Limited

Copyright © 2023, Emerald Publishing Limited

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