High performance liquid cooled aluminium nitride heat sinks

Abstract

High performance aluminium nitride water cooled heat sinks were fabricated and characterized. A variety of fabrication processes were employed to meet different cooling requirements. They include laser cut microchannel coolers for chip and multichip heat sinks as well as dry pressed pin fin heat sinks for power electronics. Thermal simulation was used to optimize the heat sink design.

Citation

Hahn, R., Glaw, V., Ginolas, A., Töpfer, M., Wittke, K. and Reichl, H. (1999), "High performance liquid cooled aluminium nitride heat sinks", Microelectronics International, Vol. 16 No. 1, pp. 21-26. https://doi.org/10.1108/13565369910250050