3D LED and IC wafer level packaging

Abstract

Purpose

The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages.

Design/methodology/approach

These packages consist of the multi‐LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed.

Findings

The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor.

Originality/value

A thermal management system for 3D IC and LEDs integration packages is proposed.

Citation

Lau, J., Lee, R., Yuen, M. and Chan, P. (2010), "3D LED and IC wafer level packaging", Microelectronics International, Vol. 27 No. 2, pp. 98-105. https://doi.org/10.1108/13565361011034786