Multi‐layer thick‐film microwave components and measurements
Abstract
The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thick‐film technology. The techniques described employ several layers of metal sandwiched by thick‐film dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thick‐film technology, offers a viable and economic solution to achieve high‐density, high‐performance microwave circuits.
Keywords
Citation
Tian, Z., Free, C., Aitchison, C., Barnwell, P. and Wood, J. (2003), "Multi‐layer thick‐film microwave components and measurements", Microelectronics International, Vol. 20 No. 1, pp. 17-20. https://doi.org/10.1108/13565360310455472
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited