Measurement techniques for the evaluation of thick‐film materials used in wireless applications

Abstract

A review of the dielectric measurement techniques that are currently available for the characterization of thick film and LTCC materials at microwave and millimeter wave frequencies is presented. The intention is to show the relative advantages and limitations of the various methods, and to provide some practical guide to the particular technique that is most suitable for a given type of material, for use in a particular application. In addition, a novel slit cavity resonator method is proposed to enable substrate parameters to be more easily measured, whilst retaining high measurement accuracy. Measured data on materials from a variety of manufacturers are presented to show the validity and usefulness of this method.

Citation

Tian, Z. and Free, C. (2001), "Measurement techniques for the evaluation of thick‐film materials used in wireless applications", Microelectronics International, Vol. 18 No. 2, pp. 21-25. https://doi.org/10.1108/13565360110391600