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Finite element approximation of turbulent thermally coupled incompressible flows with numerical sub‐grid scale modelling

Ramon Codina (Department of Strength of Materials and Structural Engineering (RMEE), Technical University of Catalonia, Barcelona, Spain)
Javier Principe (International Center for Numerical Methods in Engineering (CIMNE), Technical University of Catalonia, Barcelona, Spain)
Matías Ávila (International Center for Numerical Methods in Engineering (CIMNE), Technical University of Catalonia, Barcelona, Spain)

International Journal of Numerical Methods for Heat & Fluid Flow

ISSN: 0961-5539

Article publication date: 15 June 2010

345

Abstract

Purpose

The purpose of this paper is to describe a variational multiscale finite element approximation for the incompressible Navier‐Stokes equations using the Boussinesq approximation to model thermal coupling.

Design/methodology/approach

The main feature of the formulation, in contrast to other stabilized methods, is that the subscales are considered as transient and orthogonal to the finite element space. These subscales are solution of a differential equation in time that needs to be integrated. Likewise, the effect of the subscales is kept, both in the nonlinear convective terms of the momentum and temperature equations and, if required, in the thermal coupling term of the momentum equation.

Findings

This strategy allows the approaching of the problem of dealing with thermal turbulence from a strictly numerical point of view and discussion important issues, such as the relationship between the turbulent mechanical dissipation and the turbulent thermal dissipation.

Originality/value

The treatment of thermal turbulence from a strictly numerical point of view is the main originality of the work.

Keywords

Citation

Codina, R., Principe, J. and Ávila, M. (2010), "Finite element approximation of turbulent thermally coupled incompressible flows with numerical sub‐grid scale modelling", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 20 No. 5, pp. 492-516. https://doi.org/10.1108/09615531011048213

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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