Characterization of nanostructured copper films for electromagnetic shield

Abstract

Purpose

The purpose of this paper is to obtain a multidisciplinary characterization of nanostructured copper films for electromagnetic shields.

Design/methodology/approach

Structural and electrical analysis have been applied, on copper nanometric films produced by a magnetron sputtering device.

Findings

Data are provided for copper films realized by magnetron sputtering deposition on glass, in different operating conditions.

Practical implications

A multidisciplinary comprehension of shielding effectiveness of nanostructured thin films can be important in many applications where there are electromagnetic compatibility problems.

Originality/value

The paper gives a valuable set of information for the characterization of nanometric copper thin films.

Citation

Desideri, D., Maschio, A., Bolzan, M., Natali, M. and Spolaore, M. (2012), "Characterization of nanostructured copper films for electromagnetic shield", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 31 No. 4, pp. 1122-1132. https://doi.org/10.1108/03321641211227366