On the comparison between different space vector PWM strategies implemented in FSTPI‐fed induction motor drives

Abstract

Purpose

The paper aims to discuss the comparison of the performance of four space‐vector pulse‐width modulation (SVPWM) strategies dedicated to four‐switch three‐phase inverters (FSTPI).

Design/methodology/approach

The comparison is based on three comparison criteria: the total harmonic distortion, the switching loss factor, and the quality factor. The comparison is extended to the FFT of the phase currents and to the analysis of the ripples of the electromagnetic torque of the induction motor.

Findings

It has been clearly shown that the basic SVPWM strategy of the conventional six‐switch three‐phase inverter (SSTPI) offers better performance than those of the four FSTPI‐SVPWM strategies. This said, it has been found that the performance of two among the four FSTPI‐SVPWM strategies tend to those of the SSTPI‐SVPWM basic strategy, especially in high switching frequencies.

Research limitations/implications

The work should be extended by an experimental validation of the simulation results.

Practical implications

The established results open up crucial benefits from the point of view of cost‐effectiveness and volume‐compactness improvements of induction motor drives especially in large‐scale industries such as the automotive one where electric and hybrid propulsion systems are currently regarded as an interesting alternative to substitute or to assist the thermal propulsion systems.

Originality/value

The implementation in the FSTPI feeding an induction motor of SVPWM strategies exhibiting acceptable performance, which tend to those yielded by the SSTPI‐SVPWM basic strategy especially in high switching frequencies, is extended here.

Citation

El Badsi, B., Guermazi, A. and Masmoudi, A. (2007), "On the comparison between different space vector PWM strategies implemented in FSTPI‐fed induction motor drives", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 26 No. 1, pp. 127-147. https://doi.org/10.1108/03321640710714029