Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards

Abstract

This paper presents the defects that occur during the assembly and manufacturing of solder joints in single‐sided insertion‐mount printed wiring boards (PWBs). Each type of defect is discussed, with particular focus on how these defects are related to solderability issues, the mechanisms of failure due to defect‐induced failure accelerators, and the effect of the defect on solder joint reliability.

Citation

Hillman, C., Rogers, K., Dasgupta, A., Pecht, M., Dusek, R. and Lorence, B. (1999), "Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards", Circuit World, Vol. 25 No. 3, pp. 28-38. https://doi.org/10.1108/03056129910269025