Performance and reliability issues for a graphite based direct metalization process

Abstract

While the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes fabricated with these electroless copper alternatives remains in question. However, during the last three years, significant process improvements have been made in the direct metalization process based on a patented dispersion of graphite. This paper will describe the technology in detail and present data on the reliability and versatility of the graphite based direct metalization process.

Citation

Carano, M. (1999), "Performance and reliability issues for a graphite based direct metalization process", Circuit World, Vol. 25 No. 3, pp. 18-22. https://doi.org/10.1108/03056129910268990