Sequential Experimental Study and Optimisation of an Acid Copper Pattern Plating Process

Abstract

Sequential application of fractional factorial and response surface designs in the regression modelling and optimisation of a multi‐parameter type manufacturing process is presented. In particular, the coating thickness variation of an acid copper plating process was minimised with high bath acidity, high cathodic current density and large anode‐cathode separation. Statistically designed experiments are shown to be highly effective in studying the effects and interactions of the various process factors.

Citation

Poon, G.K.K. (1996), "Sequential Experimental Study and Optimisation of an Acid Copper Pattern Plating Process", Circuit World, Vol. 22 No. 1, pp. 7-9. https://doi.org/10.1108/03056129610799877