New materials and challenges in build‐up, RF and high speed applications – an overview

Abstract

Miniaturization, with increased functionality and use of high‐density packages is a rapidly growing facet of the electronics industry. Low loss materials for high frequency applications, low D_k materials applied for high speed signal propagation and build‐up films used in semi‐additive processes (SAP) for flip‐chip applications (line width/space down to 20 μm/20 μm) are receiving more attention. It is believed that these high performance materials will lead the electronic industry to the next level. In this paper, an overview of materials, their properties, applications and manufacturability will be addressed.

Citation

Shang, J. and Liu, Y. (2003), "New materials and challenges in build‐up, RF and high speed applications – an overview", Circuit World, Vol. 29 No. 4, pp. 28-33. https://doi.org/10.1108/03056120310478550